Data record `std.tia-569-e.structure.pathway-bonding`

Verified 2026-10-25 Confidence: High

Clause 9.4 of ANSI/TIA-569-E (2019) requires metallic pathways beyond a stated length to be bonded according to the TIA bonding and grounding standard.

Provenance. Where this record comes from and where it is used: the cited source, the record itself and the entry that cites it.

Provenance: the chain from source to entry.
Step	Item	Detail
Source	ANSI/TIA-569-E	Licensed standard, clause 9.4
Data record	std.tia-569-e.structure.pathway-bonding	Verified 2026-10-25
Entry	ANSI/TIA-569-E	No revisions

Subject: ANSI/TIA-569-E (Standards)
Kind: Standard scope
Source: ANSI/TIA-569-E, 2019 edition, clause 9.4, page 69, Telecommunications Pathways and Spaces, TIA.

History

Every recorded change to this data record, oldest first.
Date	Change
2026-10-25	created
2026-10-25	review_status unreviewed -> software_reviewed

Cite this page

Cite the governing standard for the fact itself; cite this page as the finding aid.

"Data record std.tia-569-e.structure.pathway-bonding." Fiber Optic Reference. 2026-10-25. https://www.fiberopticreference.com/data/std.tia-569-e.structure.pathway-bonding/.

Fiber Optic Reference, Data record std.tia-569-e.structure.pathway-bonding (Oct. 25, 2026), https://www.fiberopticreference.com/data/std.tia-569-e.structure.pathway-bonding/.

@misc{etr-data-std-tia-569-e-structure-pathway-bonding,
  title = {Data record std.tia-569-e.structure.pathway-bonding},
  howpublished = {\url{https://www.fiberopticreference.com/data/std.tia-569-e.structure.pathway-bonding/}},
  organization = {Fiber Optic Reference},
  publisher = {Fiber Optic Reference},
  year = {2026},
  note = {last substantive change 2026-10-25}
}

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